As design complexity increases, packaging represent a significant portion of the total manufacturing cost. Faraday works closely with partners to provide a wide selection of advanced and cost effective options, such as to deliver high-speed interface, low power dissipation, and minimal cost.

Faraday Packaging Service

Faraday turnkey partner- assembly
Faraday keeps developing new assembly resources to provide complete and high-quality IC assembly service to customers with competitive price, and has built strong relationship with top assembly houses.


The main assembly houses


ASE (Taiwan)
SPIL (Taiwan)
PTI/GTK (Taiwan)
Amkor (Taiwan, Korea, China)
TFME (China)



The main assembly service items

  • Package type evaluation and suggestion
  • Package design and production
  • Bonding evaluation and optimization
  • SiP package evaluation
  • BGA substrate design
  • Electrical and thermal simulation service
  • Assembly engineering support
  • Package failure analysis service


Available Package Types

Available package in Faraday
Faraday provides a wide range of package solutions from high-end Flip Chip BGA (FCBGA), complex System-in-Package (SiP), Ball-Grid-Array (BGA) package to the cost-conscious Quad Flat Pack (QFP) and Quad Flat No-lead (QFN) to fulfill customers' increasing demands for smaller sizes, more I/Os, and lower cost.


Lead Frame Package

Quad Flat Pack (QFP)
Quad Flat Pack (QFP) provides medium high-pin-count solutions (<256) with 4-sided peripheral leads. The minimum pitch of 0.4mm allows high design feasibility. The complete scheme is available in Faraday to fit customer's need with package sizes from 14x14mm² to 28x28mm² and pin counts from 44 to 256. QFP product line is suited to meet the most demanding applications such as controllers, micro-processors, ASIC, DSP, gate arrays (FPGA /PLD), SRAMs and PC Chipsets.


Quad Flat No-lead (QFN)
QFN package is a plastic encapsulated lead frame based CSP with lead pad on the bottom of the package, providing electrical interconnection with the printed circuit board. This package offers small form factor with 60% size reduction compared with conventional QFP package. It provides good electrical performance due to the short electrical path in the inner leads and wires. The package also provides excellent thermal performance by an optional exposed die pad to provide efficient heat path soldered on the PCB.

The small and light package with improved thermal and electrical performance makes QFN suitable for portable communication / consumer products. Applications include cellular phones, PDAs, wireless transmitters, RF front end, HD devices, microcontrollers, pre-amplifiers, servers, smart power suppliers, switches, DSPs, ASICs and wrist watches.


BGA Substrate Design

Faraday BGA substrate design
With the advantage of more electrical connections being added on as well as the inherent, potential benefit of surface mount production, Ball Grid Array (BGA) becomes the most reliable solution for high pin-count designs.

Faraday has plentiful experiences on substrate design with electrical and thermal characteristic analysis of over 10GHz applications; it is capable of delivering substrate design of various package types, such as FCBGA, FCCSP, PBGA, TFBGA with high quality and reliable BGA to customers.


Substrate design example


Cu Wire Ability

Faraday is experienced and leading in regulating the verification items for cu-wire process, and spread the items to assembly houses. Cu wire package solution is regarded as the best alternative to replace Au-wire package. In addition to the better cost, it delivers even better mechanical and electrical performance.