DDR

Updated On:2018-01-21
Gradation
Faraday IPs are rated according to the IPs’ maturity and customer acceptance. They are graded by the rules described as below,


Platinum P Five (5) productions verified
Gold G Mass production proven
Silver S Silicon proven, Formal release
Silver Minus S- Manufacturing onging
Bronze B Pre-Silicon release
 
Interface Solution > DDR
> DDR PHY - Command/Address > DDR3/3L - Command/Address 
Cell Name Descriptions Type Process Gradation Literature
FXDDR3A100HD0A DDR2/3 Combo Command /Address Block (with 2.5V IO device) ; UMC 90nm SP-RVT LowK Logic Process Analog_IP 90nm Silver Minus
FXDDR3A100HH0L DDR23 COMBO PHY CMD/ADDR BLOCK ; UMC 40LP/RVT LowK Logic Process with 2.5V device Analog_IP 40nm Silver
FXDDR3A300HF0A Command/Address Block of DDR3 Combo PHY for DIMM version ; UMC 55nm SP/RVT LowK Logic Process Analog_IP 55nm Silver
FXDDR3A300HF0L Command/Address Block of DDR3 Combo PHY for DIMM version ; UMC 55nm LP/RVT LowK Logic Process Analog_IP 55nm Silver Minus
FXDDR3A402HF0A Command/Address Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application; UMC 55nm SP/RVT LowK Logic Process Analog_IP 55nm Silver
FXDDR3A403HF0A Command/Address Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application;UMC 55nm SP/RVT LowK PROCESS. Analog_IP 55nm Silver
FXDDR3A412HF0L Command/Address Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application; UMC 55nm LP/RVT LowK Logic Process Analog_IP 55nm Bronze
FXDDR3A502HF0A Command/Address Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application (compliant to DFI); UMC 55nm SP/RVT LowK Logic Process Analog_IP 55nm Contact Sales
 
FXDDR3A502HH0L Command/Address Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application (compliant with DFI spec); UMC 40nm LP LowK Logic Process Analog_IP 40nm Silver
FXDDR3A503HH0L DDR3 Combo PHY COMM/ADDR Block for 2-rank and solder bump application; UMC 40nm LP/RVT Logic Process Analog_IP 40nm Contact Sales
 
FXDDR3AFC502HH0L DDR3 Combo PHY COMM/ADDR Block for 2-rank and solder bump application; UMC 40nm LP/RVT Logic Process Analog_IP 40nm Contact Sales