Faraday cooperates with premium FA labs and provides comprehensive FA solutions for RMA and defect identification. We ensure the best quality, abundant capacity, and on-time delivery, accelerating our customers' time to market.
Faraday FA Equipment Capability
| Equipment | Vendors/Model No. | Resolution/Detection Limit | Field of Application |
|---|---|---|---|
| Emission microscope | HAMAMATSU CS3230 | 1nA | Latch-up, gate oxide breakdown, hot carrier, leakage, Isb |
| InGaAs | HAMAMATSU PHEMOS-1000 | 1nA | Latch-up, gate oxide breakdown, hot carrier, leakage, Isb |
| OBIRCH | HSMAMATSU uAMOS-200 | 1nA | Interconnection short and open |
| Semi-Auto probe station | WENTWORTH MP-2000 | Internal probing, chip size measurement | |
| HP4155, HP4145, HP4156 | HEWLETT PACKARD | 1pA | Semiconductor parameter measurement |
| Curve tracer | TEKTRONIC 370 | 1nA | Electrical measurement |
| IR microscope | HAMAMATSU C2955 | 1000 X | Back side inspection, bonding |
| X-ray radiography | NICOLET NXR-200 | 80 X | Package inspection, Au wire inspection |
| SEM | JEOL JSM-6301 | 1.5nm | Internal inspection, package inspection, passive voltage Contrast, backscattered electron image |
| TEM | JEOL JSM -6340F FEI TECNAI | 0.27nm | Material analysis |
| Laser cutter | NEW WAVE LCS-2 | 1µm | Circuit isolation, failure site marker |
| Precision cleavage | SELA MC-100 | 1µm | Precision wafer cross section |
| Oven | NEY2-1350 | 500 C | Bake |
| Bond pull tester | UNITEK Micropul | Bond strength test | |
| Thermal emission microscope | Hamamatsu themos mini | Spectral sensitivity 3.7~5.2µm | Internal heat emissions |
| EBAC/EBIC | TESCAN | P-N junction defect Interconnection open and short defect |
