As the demands for AI applications from Cloud to Edge rises, which require various high speed interface IP, low power consumption and high performance SoC design, Faraday has well prepared with advanced process technology, comprehensive IP portfolio, and high bandwidth memory support.

Until now, Faraday has successfully completed several AI related projects including drone vision, medical image analysis, smart appliances, 3D sensing, face and speech recognition, and health status monitoring. It brings remarkable power saving, enhanced performance and lower system cost to meet the specific AI requirement.

Advanced process technology for AI/HPC

High bandwidth memory Support

To meet the requirement of AI applications for high bandwidth memory access, Faraday supports the memory chips including HBM2 and GDDR6 integrated into a single chip with the package technology of 2.5D or PIP.

Comprehensive IP portfolio

Faraday supports abundant IP solutions for AI applications, including PCIe Gen 3/4/5, SerDes 12/16/25/28/56G, MIPI D-PHY, subLVDS/LVDS, USB, HDMI TX, HBM2, GDDR6, and DDR5/DDR4/3/LPDDR4/3 at advanced FinFET process nodes, which are particularly suited for applications requiring high bandwidth, low power consumption, and low latency interfaces. In addition, Faraday provides the customization service for shrinking the macro area of embedded memory, and implements the self-repair scheme for better SRAM yield in mass production.