Visit Faraday at ICCAD 2025

11/20 ~ 11/21 | Chengdu

Faraday Fabless OSAT Service

2.5D/3D IC Packaging Integration

FPGA-Go-ASIC™ Service

• Reliable IC Development Capability
• Complete IP & Process Solution
• System BOM Cost Reduction
• Long-term Supply Commitment

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One-stop Shop to Realize Your Silicon Ideas

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Faraday 2024
CSR Report

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Industry's Most Comprehensive

28/22/14nm ASIC & IP Solutions

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Advanced Packaging Service

Chips can be composed of several dies in different process nodes with different...

FinFET ASIC Solutions

A flexible engagement model, optimized design flow, system-level services with Samsung’s FinFET technology…

SONOS eFlash Platform

Including eFlash subsystem IP with a complete eFlash testing solution (BIST) to accelerate product development and testing…

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