System-in-package (SiP, or multi-chip module) is a popular solution used in size-sensitive applications following with the SoC trend. However, the technical challenges happen not only in the packaging stage but from initial design to final testing, throughout the manufacturing processes. Accumulating abundant ASIC experiences, Faraday provides high-quality SiP design service helping customers to optimize their product performance, lower the cost, and further accelerate the time to volume.
Types of SiP
Success Cases
Faraday is experienced in integrating different types of packages, such as Flash, SDRAM DDR2 SDRAM, HDMI, RFIC, with ASIC die into lead frame or BGA package. The following example of Faraday's success cases of SiP design.
- Successful SiP Projects- LF Package
- Successful SiP Projects- BGA Package
- Case-I
- 3-die SiP package design
- ASIC+DDR2 KGD*2
- Package type: 676EDHSBGA-31x31 (with heat sink)
- 5 de-coupling capacitors added
- RDL Design on DDR2 KGD
- High-end display monitor application
- Cu-wire production is ready and has passed reliability qualification.
- 3-die SiP package design
- Case-II
- 3-die SiP package design
- ASIC+HDMI KGD+DDR2 KGD
- Package type: 256TFBGA-12x12
- RDL design on DDR2 KGD
- USB 3.1 to display application
- Hybrid bonding solution
- 3-die SiP package design
- Case-I
