Enabling innovative SoC designs smoothly
Faraday’s FinFET ASIC solutions include the flexible business engagement model, optimized design flow, system-level platform based services, and application-specific IP solutions, enabling innovative SoC designs in FinFET process technologies efficiently. By collaborating seamlessly with our ecosystem of IP, EDA, manufacturing (Intel, Samsung, and UMC), packaging, and testing partners, we present the industry-leading FinFET ASIC turnkey solution to customers worldwide.
Superior ASIC Application Coverage
From specification level to GDSII-in, our flexible business engagement model allows customers to check-in at various design phases in maximizing ASIC implementation efficiency. By leveraging Samsung’s innovative 3D-structure FinFET technology, we can bring the superior performance-power-area scaling to the diversified ASIC market.
Optimized FinFET ASIC Design Flow
Faraday has built up a robust optimized design flow, aimed for high-quality FinFET SoC designs. This flow includes synthesis, APR, timing closure, and physical verification stages.
To deal with the complex design rule checking (DRC), this design flow is color-aware in each stage to simplify the verification and shorten checking time. On top of that, Faraday’s in-house fera tool can analyze IR drop in the early design phase.
Accelerating HW & SW Designs
Faraday platform based services allow customers to begin hardware and software development well in advance of the completed silicon. The full system-level design services include core IP integration, SoC design verification, and SoC software services, accelerating customer's logic design verification and software development.
Application-Specific IP Solutions
Faraday offers IP customization service and abundant IP solutions, such as PCIe, SerDes, MIPI D-PHY, subLVDS/LVDS, USB, HDMI TX, HBM2, GDDR6, TCAM, multiple-port SRAM and DDR/LPDDR at advanced FinFET process nodes. The IPs are particularly suited for applications requiring high speed, high bandwidth, low-power consumption, and low-latency interfaces.
2.5D/3D Advanced Package Service
Faraday, teaming up with industry leaders to secure capacity and quality for customers, offers an upgraded choice for optimal cost, performance and size. The one-stop shopping and business model for 2.5D/3D advanced package service comes with robust design flow and experience. Faraday can help integrate multi-vendor/source dies or so-called chiplets, and support customized interposer design and implementation and testing. For more information.
